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Clean room fabrication process optimization for small structures
Special acoustofluidic devices demand for small strucutres. In this project the used clean room processes are optimized to achieve an improvement in minimal feature size.
Keywords: Clean room fabrication, photolithography, atomic layer deposition, Cryo, dry etch, etch angle, etch uniformity, etch selectivity, deep reactive ion etching, ICP-DRIE, acoustofluidic, design, microfluidic, characterization, SEM, profilometer
State of the art acoustofluidic devices are produced in a clean room using standard CMOS processes. Minimal feature sizes for acoustofluidic devices typically lie around several hundred micrometer because of the high aspect ratios. However, some applications demand for structures in the micrometer range. Therefore, the used clean room processes need to be optimized to achieve an improvement in minimal feature size.
State of the art acoustofluidic devices are produced in a clean room using standard CMOS processes. Minimal feature sizes for acoustofluidic devices typically lie around several hundred micrometer because of the high aspect ratios. However, some applications demand for structures in the micrometer range. Therefore, the used clean room processes need to be optimized to achieve an improvement in minimal feature size.
Microfluidic channels in silicon wafers are produced using photolithography and deep reactive ion etching. This method provides high selectivity and therefore very high aspect ratios. There are still some issues concerning the homogeneity of the photoresist layer, the selectivity of the etch process and the etch angle. In this project, these aspects are evaluated and improved to achieve lower minimal feature size. The results are analysed using scanning electron microscopy. Finally, devices are produced and evaluated using the new process flow.
Microfluidic channels in silicon wafers are produced using photolithography and deep reactive ion etching. This method provides high selectivity and therefore very high aspect ratios. There are still some issues concerning the homogeneity of the photoresist layer, the selectivity of the etch process and the etch angle. In this project, these aspects are evaluated and improved to achieve lower minimal feature size. The results are analysed using scanning electron microscopy. Finally, devices are produced and evaluated using the new process flow.
Name: Michael Gerlt
Email: gerlt@imes.mavt.ethz.ch
Group: Prof. Dr. J. Dual
http://www.expdyn.ethz.ch/research.html
Name: Michael Gerlt
Email: gerlt@imes.mavt.ethz.ch
Group: Prof. Dr. J. Dual
http://www.expdyn.ethz.ch/research.html
Clean room fabrication process optimization for small structures.pdf
