Register now After registration you will be able to apply for this opportunity online.
This opportunity is not published. No applications will be accepted.
Coupling Light into a Chip through the Substrate
Design a grating coupler which can couple light from an optical fiber into a photonic chip through the chip substrate. The project is 75% Design & Simulation, 25% Measurement.
Grating couplers are commonly used in integrated photonics to couple light from an optical fiber into a photonic microchip. There, the fiber usually comes from the topside of the chip. However, nowadays big efforts are taken to co-integrate photonic chips with other microchips by means of flip-chip bonding, which establishes an electric connection between the two chips. This poses challenges to light coupling as the top side of the chip cannot be accessed anymore with the fiber due to the flip-chip bonding. We therefore want to explore the possiblity to couple light into the photonic chip through the chip substrate.
Grating couplers are commonly used in integrated photonics to couple light from an optical fiber into a photonic microchip. There, the fiber usually comes from the topside of the chip. However, nowadays big efforts are taken to co-integrate photonic chips with other microchips by means of flip-chip bonding, which establishes an electric connection between the two chips. This poses challenges to light coupling as the top side of the chip cannot be accessed anymore with the fiber due to the flip-chip bonding. We therefore want to explore the possiblity to couple light into the photonic chip through the chip substrate.
Your goal is to design a grating coupler which can be used to couple light from an optical fiber into a photonic chip through the chip substrate. For this, the grating coupler should be simulated in a program like COMSOL and optimized for maximum coupling efficiency and fabrication robustness. The design will then be fabricated on a integrated photonic chip by the supervisors in the cleanroom. Afterwards, you will measure your coupler and verify the designed properties.
If the design is successful, it will be used for a scientific project which aims at combining high-speed photonics and superconducting computation logic by means of flip-chip bonding.
Your goal is to design a grating coupler which can be used to couple light from an optical fiber into a photonic chip through the chip substrate. For this, the grating coupler should be simulated in a program like COMSOL and optimized for maximum coupling efficiency and fabrication robustness. The design will then be fabricated on a integrated photonic chip by the supervisors in the cleanroom. Afterwards, you will measure your coupler and verify the designed properties. If the design is successful, it will be used for a scientific project which aims at combining high-speed photonics and superconducting computation logic by means of flip-chip bonding.
a) Conventional fiber-to-chip coupling from the topside of the photonic chip using a standard grating coupler.
b) Goal: Couple light into a photonic chip through the substrate, while the chip is flip-chip bonded to another microchip.
c) SEM image of a standard grating coupler. Note the size of only a few micrometers.
a) Conventional fiber-to-chip coupling from the topside of the photonic chip using a standard grating coupler. b) Goal: Couple light into a photonic chip through the substrate, while the chip is flip-chip bonded to another microchip. c) SEM image of a standard grating coupler. Note the size of only a few micrometers.
Design & Simulation (75%)
Measurement (25%)
Depending on your interest and pre-knowledge, we can adapt the focus of your thesis.
Design & Simulation (75%) Measurement (25%)
Depending on your interest and pre-knowledge, we can adapt the focus of your thesis.
You should be motivated to expand your knowledge about the interesting topic of integrated photonics. Fundamental knowledge of optics is required (lecture “Optics & Photonics” or similar).
You should be motivated to expand your knowledge about the interesting topic of integrated photonics. Fundamental knowledge of optics is required (lecture “Optics & Photonics” or similar).
ETH Zurich
Dominik Bisang, ETZ K 95
Prof. Dr. Jürg Leuthold, ETZ K 81
Gloriastrasse 35
8092 Zurich
Email: dbisang@ethz.ch
If you are interested in the thesis, just write a email and we can meet to discuss further details and answer your questions! :-)
ETH Zurich Dominik Bisang, ETZ K 95 Prof. Dr. Jürg Leuthold, ETZ K 81 Gloriastrasse 35 8092 Zurich
Email: dbisang@ethz.ch
If you are interested in the thesis, just write a email and we can meet to discuss further details and answer your questions! :-)