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Modeling and Simulation of Silicon Cutting Processes
Flawless silicon cutting is highly dependent on the material removal mode. The study of the transition between ductile and brittle removal behaviors is a major focus of the scientific community. With the help of numerical methods, a deeper understanding of silicon cutting can be obtained.
Keywords: simulation, silicon, manufacturing, Smoothed Particle Hydrodynamic (SPH), FEM
Single crystal silicon is one of the most important semiconductors, and it is widely used in many industrial fields. Machining of silicon is quite challenging due to the high brittleness, which may lead to microcracks and deteriorate the surface finish. The quality of silicon machining preliminary depends on the material removal mode. Under certain conditions, the brittle silicon can be machined in ductile mode, in which the surface damage can be largely avoided. In order to obtain the insight of ductile and brittle removal mechanisms, modeling and simulation of silicon single grain scratching will be conducted in this project.
Based on the Smoothed Particle Hydrodynamics (SPH) method, a software named mfree_iwf has been developed for cutting simulation at the Institute of Machine Tools and Manufacturing (IWF). The mfree_iwf has been successfully applied to the simulation of ductile material machining processes, in which the chip formation and other physical fields can be predicted accurately. We would like to extend mfree_iwf to the field of brittle material cutting simulation. In this project, you will have the chance to select in a wide range of possible modeling and simulation tasks (we have many open topics for selection, such as material modeling, contact modeling, fracture mechanics and so on), and conduct the sensitivity study of how the input parameters influence the material removal mode. The simulation result of single grain scratching will be validated by the experimental test result available at the IWF.
Single crystal silicon is one of the most important semiconductors, and it is widely used in many industrial fields. Machining of silicon is quite challenging due to the high brittleness, which may lead to microcracks and deteriorate the surface finish. The quality of silicon machining preliminary depends on the material removal mode. Under certain conditions, the brittle silicon can be machined in ductile mode, in which the surface damage can be largely avoided. In order to obtain the insight of ductile and brittle removal mechanisms, modeling and simulation of silicon single grain scratching will be conducted in this project.
Based on the Smoothed Particle Hydrodynamics (SPH) method, a software named mfree_iwf has been developed for cutting simulation at the Institute of Machine Tools and Manufacturing (IWF). The mfree_iwf has been successfully applied to the simulation of ductile material machining processes, in which the chip formation and other physical fields can be predicted accurately. We would like to extend mfree_iwf to the field of brittle material cutting simulation. In this project, you will have the chance to select in a wide range of possible modeling and simulation tasks (we have many open topics for selection, such as material modeling, contact modeling, fracture mechanics and so on), and conduct the sensitivity study of how the input parameters influence the material removal mode. The simulation result of single grain scratching will be validated by the experimental test result available at the IWF.
Coding with C++ program, study on the material removal mode under different cutting conditions. The ultimate objective is to provide insights for silicon removal mechanisms and optimize the cutting process.
Coding with C++ program, study on the material removal mode under different cutting conditions. The ultimate objective is to provide insights for silicon removal mechanisms and optimize the cutting process.
Nanyuan Zhang (zhang@iwf.mavt.ethz.ch), Institute of Machine Tools and Manufacturing, D-MAVT, ETH Zürich
Nanyuan Zhang (zhang@iwf.mavt.ethz.ch), Institute of Machine Tools and Manufacturing, D-MAVT, ETH Zürich